Search engine for discovering works of Art, research articles, and books related to Art and Culture
ShareThis
Javascript must be enabled to continue!

Warpage Prediction of RHCM Crystalline Parts Based on Multi-Layers

View through CrossRef
Warpage is a typical defect for injection-molded parts, especially for crystalline parts molded by rapid heat cycle molding (RHCM). In this paper, a prediction method is proposed for predicting the warpage of crystalline parts molded by the RHCM process. Multi-layer models were established to predict warpage with the same thicknesses as the skin-core structures in the molded parts. Warpages were defined as the deformations calculated by the multi-layer models. The deformations were solved using the classical laminated plate theory by Abaqus. A model was introduced to describe the elastic modulus with the influence of temperature and crystallinity. The simulation process was divided into two procedures, before ejection and after ejection. Thermal stresses and thermal strains were simulated, respectively, in the procedure before ejection and after ejection. The prediction results were compared with the experimental results, which showed that the average errors between predicted warpage and average experimental warpage are, respectively, 7.0%, 3.5%, and 4.4% in conventional injection molding (CIM), in RHCM under a 60 °C heating mold (RHCM60), and in RHCM under a 90 °C heating mold (RHCM90).
Title: Warpage Prediction of RHCM Crystalline Parts Based on Multi-Layers
Description:
Warpage is a typical defect for injection-molded parts, especially for crystalline parts molded by rapid heat cycle molding (RHCM).
In this paper, a prediction method is proposed for predicting the warpage of crystalline parts molded by the RHCM process.
Multi-layer models were established to predict warpage with the same thicknesses as the skin-core structures in the molded parts.
Warpages were defined as the deformations calculated by the multi-layer models.
The deformations were solved using the classical laminated plate theory by Abaqus.
A model was introduced to describe the elastic modulus with the influence of temperature and crystallinity.
The simulation process was divided into two procedures, before ejection and after ejection.
Thermal stresses and thermal strains were simulated, respectively, in the procedure before ejection and after ejection.
The prediction results were compared with the experimental results, which showed that the average errors between predicted warpage and average experimental warpage are, respectively, 7.
0%, 3.
5%, and 4.
4% in conventional injection molding (CIM), in RHCM under a 60 °C heating mold (RHCM60), and in RHCM under a 90 °C heating mold (RHCM90).

Related Results

Dynamic warpage simulation of molded PCB under reflow process
Dynamic warpage simulation of molded PCB under reflow process
Purpose This study aims to simulate molded printed circuit board (PCB) warpage behavior under reflow temperature distribution. Simulation models are used to estimate dynamic warpag...
Numerical simulation on the warpage of reconstructed wafer during encapsulation process
Numerical simulation on the warpage of reconstructed wafer during encapsulation process
Abstract At present, the general fan-out package generally uses the molding process and uses epoxy molding compound (EMC) material to complete the reconstruction of ...
Substrate Warpage Study for Heterogeneous Packages
Substrate Warpage Study for Heterogeneous Packages
Warpage formation in semiconductor packages is generally known to occur from coefficient of thermal expansion (CTE) mismatches between multilayered materials with different propert...
Measurement and Modeling of the Polyimide Dielectric Coating Induced Wafer Warpage
Measurement and Modeling of the Polyimide Dielectric Coating Induced Wafer Warpage
ABSTRACT Polyimide is widely used as a dielectric coating material in the re-distribution layer (RDL) of wafer level packaging (WLP) due to its excellent thermal,...
Hyper BGA Package Assembly: Experimental Design and Process Development
Hyper BGA Package Assembly: Experimental Design and Process Development
ABSTRACT The increasing complexity of Ball Grid Array (BGA) packages, characterized by larger sizes and finer pitches, necessitates the development of advanced as...
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
Wafer-level packaging (WLP) is a pivotal semiconductor packaging technology that enables heterogeneously integrated advanced semiconductor packages with high-density electrical int...
Ultra-Low Warpage and Excellent Filling Ability Liquid MUF for Advanced Fan-Out Wafer Level Package
Ultra-Low Warpage and Excellent Filling Ability Liquid MUF for Advanced Fan-Out Wafer Level Package
ABSTRACT In recent years, the demands for higher speed and smaller and thinner semiconductor devices are increasing, and the demand for fan-o...

Back to Top