Study of Strained-SiGe Channel P-MOSFET Using Silvaco TCAD: Impact of Channel Thickness

Compressively strained SiGe is an interesting channel material for sub 45 nm p-MOSFETs because of its superior hole mobility (up to 10x over bulk Si channels) and compatibility with current Si manufacturing technologies. In this work, the impact of heterostructure composition and SiGe channel thickness on the electrical characteristics of p-MOSFET are studied. Using strained Si0.8Ge0.2 p-MOSFET, the thickness was altered to a few thicknesses of 3 nm, 5 nm, 7 nm, and 9 nm respectively. The optimal thickness was then used for Ge compositions (x = 0.2). The project was realized utilizing computer-aided Silvaco TCAD tools, with ATHENA tools creating the p-MOSFET structure and ATLAS tools doing the device simulation. The strained-Si1-xGex p-MOSFET and the Si p-MOSFET were compared in terms of their performances. The ID-VG and ID-VD characteristics, as well as the threshold voltage, VTH extraction, were the focus of the device simulation. The 7 nm thickness strained-Si0.8Ge0.2 p-MOSFET exhibited lower VTH than other SiGe thicknesses and the Si p-MOSFET which is VTH = 0.074 V. The lower threshold voltage of the strained-Si0.8Ge0.2 with 7 nm thickness indicating that the strained-Si1-xGex contributed to the decreased power consumption. In addition, the extracted IDsat for the strained-Si0.8Ge0.2 p-MOSFET with 7nm thickness provided higher IDsat compared to conventional Si p-MOSFET and other SiGe thicknesses devices. As compared to Si p-MOSFETs, the output characteristics of the strained-Si1-xGex demonstrated a drain current improvement by a factor of 1.01.