Electrical, structural and morphological characteristics of rapidly annealed Ni/Pd Schottky rectifiers on n ‐type GaN

Abstract Schottky rectifiers are fabricated on n ‐type GaN using Ni/Pd metallization scheme and its characteristics have been investigated by current‐voltage (I‐V), Capacitance‐Voltage (C‐V), X‐Ray Diffraction (XRD) and SIMS measurements as a function of annealing temperature. The calculated Schottky barrier height of the as‐deposited contact was found to be 0.60 eV (I‐V), 0.71 eV (C‐V) with an ideality factor of 1.44. However, the barrier height slightly increases after annealing at 300, 400 and 500 °C. On the basis of the experimental results, a high‐quality Schottky contact with barrier height and ideality factor of 0.81 eV (I‐V), 0.88 eV (C‐V) and 1.13 respectively, can be obtained after annealing at 600 °C for 1 min in a nitrogen atmosphere. Further, after annealing at 700 °C, it is found that the barrier height slightly decreased to 0.74 eV (I‐V) and 0.85 eV (C‐V). From the above observations, one can note that Ni/Pd Schottky contact exhibits excellent electrical properties after a rapid thermal annealing at 600 °C. According to the SIMS and XRD analysis, the formation of gallide phases at the Ni/Pd/ n ‐GaN interface could be the reason of the barrier height increase at elevated annealing temperatures. The Atomic Force Microscopy (AFM) results show that the overall surface morphology of Ni/Pd Schottky contacts on n ‐GaN is fairly smooth. The above observations reveal that Ni/Pd Schottky metallization scheme was a good choice for the fabrication of high‐temperature and high‐power device applications. Copyright © 2010 John Wiley & Sons, Ltd.