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Advancement in Thermosonic Bonding Wire
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Coated copper (Cu) and alloyed silver (Ag) wires are the new developments in bonding wire sector and this paper discusses on its bonding performances. Palladium (Pd) coated Cu wire replaces rapidly with Au wire. A thin gold (Au) coating over Pd coated Cu wire revealed wider 2nd bond process window and superior 2nd bond bondability, termed as Au Flash Pd Coated Cu Wire (AFPC). The free air ball (FAB) formation, looping, 1st bond and reliability performance of the AFPC wire satisfies the basic requirements. The benefits of doped/alloyed Cu wire are also presented. Good reflectance properties of Ag wire replaces with Au wire in LED sector. Moreover, soft nature of Ag wire and its FAB near to Au, turn the focus to Ag as a potential bonding wire. Detailed examination on alloying additions, Ag electro migration, reliability, bondability, FAB formation, etc., are currently examined and discussed. During bonding, purging with forming gas is a common practice irrespective of the wires used (bare/alloyed/coated Cu or Ag wires).
IMAPS - International Microelectronics Assembly and Packaging Society
Title: Advancement in Thermosonic Bonding Wire
Description:
Coated copper (Cu) and alloyed silver (Ag) wires are the new developments in bonding wire sector and this paper discusses on its bonding performances.
Palladium (Pd) coated Cu wire replaces rapidly with Au wire.
A thin gold (Au) coating over Pd coated Cu wire revealed wider 2nd bond process window and superior 2nd bond bondability, termed as Au Flash Pd Coated Cu Wire (AFPC).
The free air ball (FAB) formation, looping, 1st bond and reliability performance of the AFPC wire satisfies the basic requirements.
The benefits of doped/alloyed Cu wire are also presented.
Good reflectance properties of Ag wire replaces with Au wire in LED sector.
Moreover, soft nature of Ag wire and its FAB near to Au, turn the focus to Ag as a potential bonding wire.
Detailed examination on alloying additions, Ag electro migration, reliability, bondability, FAB formation, etc.
, are currently examined and discussed.
During bonding, purging with forming gas is a common practice irrespective of the wires used (bare/alloyed/coated Cu or Ag wires).
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