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Deep Level Investigation in Si-GaAs by Rapid Thermal Annealing

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ABSTRACTDeep levels in undoped LEC semi-insulating (SI) GaAs have been investigated by rapid thermal annealing (RTA). The GaAs wafers were annealed for 10 sec in N2 atmosphere at temperatures ranging from 500 to 800 °C. Using photo-induced current transient spectroscopy (PITS) and Hall measurement, we have investigated the behavior of various deep levels as a function of RTA temperature and the phenomenon of thermal conversion. The change and even conversion in resistivity is related not only to decrease of the EL2 and EL6 defects, but also to shallow acceptor caused by arsenic-escaping in the surface of the wafer. Choosing proper RTA temperaturte will improve the electrical properties of SI-GaAs after RTA.
Springer Science and Business Media LLC
Title: Deep Level Investigation in Si-GaAs by Rapid Thermal Annealing
Description:
ABSTRACTDeep levels in undoped LEC semi-insulating (SI) GaAs have been investigated by rapid thermal annealing (RTA).
The GaAs wafers were annealed for 10 sec in N2 atmosphere at temperatures ranging from 500 to 800 °C.
Using photo-induced current transient spectroscopy (PITS) and Hall measurement, we have investigated the behavior of various deep levels as a function of RTA temperature and the phenomenon of thermal conversion.
The change and even conversion in resistivity is related not only to decrease of the EL2 and EL6 defects, but also to shallow acceptor caused by arsenic-escaping in the surface of the wafer.
Choosing proper RTA temperaturte will improve the electrical properties of SI-GaAs after RTA.

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