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Experimental study on the bonding of microfluidic chip
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Abstract
In this paper, the ultraviolet radiation curing technology is applied to the processing and manufacturing of microfluidic chips, and a new method of irradiation bonding of photocuring microfluidic chips is studied. Research has shown that by photocuring bonding method, the bonding strength of the photocuring microfluidic chip is high, the bonding speed is fast, the efficiency is high, and since the auxiliary solvent such as adhesive is not needed, the microchannel is not polluted, and the permanent bonding is realized. This new method of photocuring bonding has effectively solved the bonding problem of the microfluidic chip and the photocuring bonding strength satisfies the application requirements.
Title: Experimental study on the bonding of microfluidic chip
Description:
Abstract
In this paper, the ultraviolet radiation curing technology is applied to the processing and manufacturing of microfluidic chips, and a new method of irradiation bonding of photocuring microfluidic chips is studied.
Research has shown that by photocuring bonding method, the bonding strength of the photocuring microfluidic chip is high, the bonding speed is fast, the efficiency is high, and since the auxiliary solvent such as adhesive is not needed, the microchannel is not polluted, and the permanent bonding is realized.
This new method of photocuring bonding has effectively solved the bonding problem of the microfluidic chip and the photocuring bonding strength satisfies the application requirements.
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