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Back-to-Basics SMT Assembly
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ABSTRACT
Co-Hosted with SMTA Europe
Free for SMTA Members!
Overview
Beginners Guide to Surface Mount Assembly
Since its advent in the early 1980s, the use of surface mount components and assembly methods have become a fundamental part of electronics circuit card manufacture in both the commercial and high reliability sectors. But what is surface mount and how are surface mount circuit boards actually produced in practice?
This webinar provides an elementary guide to the background relating to surface mount technology and the manufacturing steps that are involved in the production of these types of assemblies.
This webinar is aimed at providing a basic introduction to terminology and manufacturing for those who are new to the industry and also those who deal with and support manufacturing indirectly (i.e. purchasing, designers, account managers, sales staff etc.)
Topics will include: -
* An overview of Surface Mount technology - what is it?
* Basic guide to terminology
* Surface Mount Component Types
* Component Preparation & Handling
* How Circuit Card Assemblies are made - Manual Assembly
* How Circuit Card Assemblies are made - Automated Assembly Methods including Solder Application, Component Placement and Solder Reflow Methods
* Inspection Methods for Surface Mount Boards
About the Presenter
Charles Cawthorne graduated with a BSc (Hons) in Chemical Engineering, followed by a PhD from Imperial College (London). His PhD, which was surface science based looking at the impact of brass formation in catalysts used for large scale methanol production, earnt the Institute of Energy RH Gummer Award in 1985.
Charles has been working for MBDA since 1984. For the first 15 years, he was involved in the design, manufacture and test of complex thick film chip and wire hybrids and the development of a process to manufacture thick film copper substrates.
In 1999, Charles became involved in the production of PCAs, leading to his appointment of Company Technical Expert for Circuit Card Assembly Manufacture in October 2005.
Charles was invited to join the technical committee of SMART Group in late 2010 and has presented at a number of conferences, seminars and webinars on various topics relating to Electronics Manufacturing.
Files Available:
Recorded Presentation (On-Demand)
Slides (PDF)
Title: Back-to-Basics SMT Assembly
Description:
ABSTRACT
Co-Hosted with SMTA Europe
Free for SMTA Members!
Overview
Beginners Guide to Surface Mount Assembly
Since its advent in the early 1980s, the use of surface mount components and assembly methods have become a fundamental part of electronics circuit card manufacture in both the commercial and high reliability sectors.
But what is surface mount and how are surface mount circuit boards actually produced in practice?
This webinar provides an elementary guide to the background relating to surface mount technology and the manufacturing steps that are involved in the production of these types of assemblies.
This webinar is aimed at providing a basic introduction to terminology and manufacturing for those who are new to the industry and also those who deal with and support manufacturing indirectly (i.
e.
purchasing, designers, account managers, sales staff etc.
)
Topics will include: -
* An overview of Surface Mount technology - what is it?
* Basic guide to terminology
* Surface Mount Component Types
* Component Preparation & Handling
* How Circuit Card Assemblies are made - Manual Assembly
* How Circuit Card Assemblies are made - Automated Assembly Methods including Solder Application, Component Placement and Solder Reflow Methods
* Inspection Methods for Surface Mount Boards
About the Presenter
Charles Cawthorne graduated with a BSc (Hons) in Chemical Engineering, followed by a PhD from Imperial College (London).
His PhD, which was surface science based looking at the impact of brass formation in catalysts used for large scale methanol production, earnt the Institute of Energy RH Gummer Award in 1985.
Charles has been working for MBDA since 1984.
For the first 15 years, he was involved in the design, manufacture and test of complex thick film chip and wire hybrids and the development of a process to manufacture thick film copper substrates.
In 1999, Charles became involved in the production of PCAs, leading to his appointment of Company Technical Expert for Circuit Card Assembly Manufacture in October 2005.
Charles was invited to join the technical committee of SMART Group in late 2010 and has presented at a number of conferences, seminars and webinars on various topics relating to Electronics Manufacturing.
Files Available:
Recorded Presentation (On-Demand)
Slides (PDF).
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