Javascript must be enabled to continue!
DEVELOPMENT OF A METHOD FOR DETERMINATION OF THERMOPELASTIC STRESSES IN GAAS PLATES
View through CrossRef
Purpose. А study of the temperature field of the melt during the cultivation of GaAs single crystals from under a layer of liquid flux. Thermoplastic stresses were measured on plates cut from the upper, middle and lower part of the ingot of undoped GaAs.Methodology. Finite element method is used to calculate temperature profiles and internal thermoplastic stresses. The mechanism of theoretical and experimental researches which allow to predict thermoplastic stresses in the course of cultivation of ingots is offered. For the analysis and mathematical calculations of the stationary differential equation in partial derivatives and the equations of thermoelasticity, respectively, use the finite element method, the calculations were performed in the programs THERMIX and INCA. Temperature profiles and internal thermoplastic stresses were calculated. Thermoplastic stresses were measured on plates cut from the upper, middle and lower part of the ingot of undoped GaAs (cm-3) with a thickness of 1 mm with a resistivity of 108 Ohm x cm, diameter 50 mm, orientation (111).The axial temperature gradient is determined. Experimentally obtained values of ison voltage lines along the plane of GaAs plates cut from different parts of the ingot. To measure the internal (thermoplastic) stresses in the work used the method of photoelastic-guests in infrared polarized light. The integrated picture of thermoplastic stresses was obtained using the "Polaron" installation, and the point measurement with the construction of the iso-voltage line was obtained on the "Polaron-2" installation. Originality. As a result of the research it can be concluded that the mechanism of theoretical and experimental researches is offered in the work, which allows to predict thermoplastic stresses in the process of growing GaAs ingots and, finally, to develop a procedure for reducing dislocation density in GaAs ingots. The practical value. the proposed method will improve the technology of growing ingots of gallium arsenide with a more homogeneous technology, which will be a good indicator for the future creation of gas sensors from this material.
Kremenchuk Mykhailo Ostohradskyi National University
Title: DEVELOPMENT OF A METHOD FOR DETERMINATION OF THERMOPELASTIC STRESSES IN GAAS PLATES
Description:
Purpose.
А study of the temperature field of the melt during the cultivation of GaAs single crystals from under a layer of liquid flux.
Thermoplastic stresses were measured on plates cut from the upper, middle and lower part of the ingot of undoped GaAs.
Methodology.
Finite element method is used to calculate temperature profiles and internal thermoplastic stresses.
The mechanism of theoretical and experimental researches which allow to predict thermoplastic stresses in the course of cultivation of ingots is offered.
For the analysis and mathematical calculations of the stationary differential equation in partial derivatives and the equations of thermoelasticity, respectively, use the finite element method, the calculations were performed in the programs THERMIX and INCA.
Temperature profiles and internal thermoplastic stresses were calculated.
Thermoplastic stresses were measured on plates cut from the upper, middle and lower part of the ingot of undoped GaAs (cm-3) with a thickness of 1 mm with a resistivity of 108 Ohm x cm, diameter 50 mm, orientation (111).
The axial temperature gradient is determined.
Experimentally obtained values of ison voltage lines along the plane of GaAs plates cut from different parts of the ingot.
To measure the internal (thermoplastic) stresses in the work used the method of photoelastic-guests in infrared polarized light.
The integrated picture of thermoplastic stresses was obtained using the "Polaron" installation, and the point measurement with the construction of the iso-voltage line was obtained on the "Polaron-2" installation.
Originality.
As a result of the research it can be concluded that the mechanism of theoretical and experimental researches is offered in the work, which allows to predict thermoplastic stresses in the process of growing GaAs ingots and, finally, to develop a procedure for reducing dislocation density in GaAs ingots.
The practical value.
the proposed method will improve the technology of growing ingots of gallium arsenide with a more homogeneous technology, which will be a good indicator for the future creation of gas sensors from this material.
Related Results
Surface Corrugation of GaAs Layers Grown on (775)B-Oriented GaAs Substrates by Molecular Beam Epitaxy
Surface Corrugation of GaAs Layers Grown on (775)B-Oriented GaAs Substrates by Molecular Beam Epitaxy
Surface morphologies of GaAs layers grown on (775)B-oriented GaAs substrates by molecular beam epitaxy were studied using atomic force microscopy. The surface of a GaAs layer gr...
GaAs/Ge/GaAs Sublattice Reversal Epitaxy on GaAs (100) and (111) Substrates for Nonlinear Optical Devices
GaAs/Ge/GaAs Sublattice Reversal Epitaxy on GaAs (100) and (111) Substrates for Nonlinear Optical Devices
Sublattice reversal epitaxy is demonstrated in lattice-matched
GaAs/Ge/GaAs (100) and (111) systems using molecular beam epitaxy, and confirmed
by reflection high energy elec...
Analysis of the relation between spectral response and absorptivity of GaAs photocathode
Analysis of the relation between spectral response and absorptivity of GaAs photocathode
In order to study the relation between spectral response and absorptivity of GaAs photocathode, two kinds of GaAs photocathodes are prepared by molecular beam epitaxy (MBE) and met...
Increase of Critical Thickness and Optical Emission Range in (InAs)1(GaAs)n Strained Short-Period Superlattices
Increase of Critical Thickness and Optical Emission Range in (InAs)1(GaAs)n Strained Short-Period Superlattices
The critical thickness and optical emission wavelength range of (InAs)1(GaAs)
n
strained sho...
Temperature-Programmed Scattering (TPS) Study on Reactivity Difference of GaAs and GaAs Oxide Surfaces
Temperature-Programmed Scattering (TPS) Study on Reactivity Difference of GaAs and GaAs Oxide Surfaces
The reactivity of GaAs and GaAs oxide surfaces to trimethylgallium (TMG) was studied by temperature-programmed scattering (TPS) through the energy accommodation coefficient (EAC). ...
Continuous GaAs Film Growth on Epitaxial Si Surface in Initial Stage of GaAs/Si Heteroepitaxy
Continuous GaAs Film Growth on Epitaxial Si Surface in Initial Stage of GaAs/Si Heteroepitaxy
Improvements in the initial stage of GaAs growth on the epitaxial silicon surface without high-temperature Si surface treatment and in the GaAs-Si interface have been observed for ...
Growth and Characterization of GaAs/GaSe/Si Heterostructures
Growth and Characterization of GaAs/GaSe/Si Heterostructures
We have grown and characterized epitaxial GaAs grown on layered structure GaSe on As-passivated Si(111) for the purpose of using layered structure GaSe as a lattice mismatch/therma...
Diffusion of Gallium Vacancies from Low-Temperature-Grown GaAs
Diffusion of Gallium Vacancies from Low-Temperature-Grown GaAs
Diffusion of crystalline defects from low-temperature-grown GaAs (LT-GaAs) during annealing at 600°C has been studied. Gallium vacancies diffuse from the LT-GaAs layer into an adja...

