Taguchi L8 Orthogonal Array and ANOVA-Based Optimization of Injection Molding Parameters for Reducing Warpage in Set-Top Box Components

This study seeks to optimize injection molding process parameters to minimize defects such as warpage and short shots in the manufacturing of Set-Top Box components. The Design of Experiments (DoE) methodology, employing the Taguchi technique and a L8 orthogonal array, examined six essential parameters: flow rate, melt temperature, mold temperature, holding pressure, gate diameter, and runner diameter. The influence and statistical significance of each parameter were evaluated using Analysis of Variance (ANOVA). The findings indicated that melt temperature, mold temperature, and holding pressure are crucial in reducing warpage, with melt temperature accounting for 48.08% of the difference. The mold temperature and holding pressure contributed 21.37% and 6.90%, respectively. The research shows that maximizing these critical parameters is vital for minimizing warpage and short shots, hence improving dimensional accuracy and overall quality of injection-molded components. The results offer significant insights and actionable recommendations for enhancing efficiency and product quality in injection molding processes, laying the groundwork for subsequent study in process optimization.