Numerical simulation research on curing process of composite overwrap considering a die model

During curing process of composite overwrap the die shows a significant influence on the temperature field, curing degree distribution, and curing deformation. The curing process can thus not be accurately simulated without a die. In this paper, a model of the composite overwrap with a die and two models without dies were respectively created. The finite element method was employed to solve the equations for describing the thermo-chemical model coupled with the cure kinetic model. The validity of the simulation was experimentally verified. The temperature distribution and the curing degree field of the composite overwrap were outlined and the effect of the die on the curing process was evaluated for each model. With the aid of the thermal analysis, the curing deformation as a result of the thermo-chemical shrinkage was presented and the difference in thermal expansion coefficients between the composite overwrap and the die was illustrated. The effect of the stacking sequence of multi-layers on the curing deformation of the composite overwrap was also evaluated, taking into account the changes in the resin properties during the curing process.