Thermal and Microstructural Characterization of the Multicomponent Alloy Al33wt%Cu1wt%Ni-1.2wt%Ta Solidified with Transient Heat Flow

The demand for materials with specific properties continues to grow in modern industry, necessitating a deeper understanding of metal solidification processes. This study investigates the thermal and microstructural characteristics of a novel multicomponent alloy, Al33wt%Cu1wt%Ni-1.2wt%Ta, which has not been previously reported in the literature. This alloy, comprising aluminum, copper, nickel and tantalum, exhibits superior mechanical strength, thermal stability and corrosion resistance compared to conventional alloys, making it suitable for various applications. Utilizing transient heat flow techniques, thermal characterization and microstructural analysis were performed on the alloy after solidification. Thermal mapping revealed variable growth and cooling rates along the ingot, influencing macrostructural transitions from columnar to equiaxed grains. Microstructural examination uncovered a complex evolution, with refined dendritic spacings initially, followed by the formation of intermetallic phases such as Al3Ta, α-Al and Al2Cu. The study also proposed a hypothesis on the formation of diamond-shaped intermetallics like Ni3Ta and Ta(Cu,Al)2, which were consumed to form Al7Cu4Ni at the edges. Secondary dendritic spacing analysis supported this hypothesis, showing correlation with growth laws. The findings provide valuable insights into solidification behavior and microstructural evolution, aiding in parameter optimization and enhancing the alloy’s properties for specific applications. However, limitations include the need for further research to explore mechanical and thermal properties and validate industrial potential.