Javascript must be enabled to continue!
Warpage Characterization of Thin and Centrally-Gated Injection Molded Part by Applying Cavity Pressure Measurement
View through CrossRef
Two types of injection molded parts including parts with thin shell feature and parts molded with radial flow pattern are highly susceptible to the warpage. In this research, the warpage performance of a thin and centrally-gated disk was experimentally investigated. The melt pressure-time traces of two different locations inside the mold cavity were monitored by employing piezoelectric transducers. The results indicated that the pressure difference magnitude of melt at two locations along the radial flow path is related to the extent of molded part deformation. Moreover, it was pointed out that the high magnitude of warpage is because of two conflicting actions in the molded part comprising expansion as a result of viscoelastic recovery in the central region, and thermal contraction in the edge region of the thin disk. The molding variables encompassing injection speed, holding pressure, back pressure, mold temperature and screw rotational speed affected the thin disks deformation in order of significance.
Trans Tech Publications, Ltd.
Title: Warpage Characterization of Thin and Centrally-Gated Injection Molded Part by Applying Cavity Pressure Measurement
Description:
Two types of injection molded parts including parts with thin shell feature and parts molded with radial flow pattern are highly susceptible to the warpage.
In this research, the warpage performance of a thin and centrally-gated disk was experimentally investigated.
The melt pressure-time traces of two different locations inside the mold cavity were monitored by employing piezoelectric transducers.
The results indicated that the pressure difference magnitude of melt at two locations along the radial flow path is related to the extent of molded part deformation.
Moreover, it was pointed out that the high magnitude of warpage is because of two conflicting actions in the molded part comprising expansion as a result of viscoelastic recovery in the central region, and thermal contraction in the edge region of the thin disk.
The molding variables encompassing injection speed, holding pressure, back pressure, mold temperature and screw rotational speed affected the thin disks deformation in order of significance.
Related Results
Dynamic warpage simulation of molded PCB under reflow process
Dynamic warpage simulation of molded PCB under reflow process
Purpose
This study aims to simulate molded printed circuit board (PCB) warpage behavior under reflow temperature distribution. Simulation models are used to estimate dynamic warpag...
Overview of Key Zonal Water Injection Technologies in China
Overview of Key Zonal Water Injection Technologies in China
Abstract
Separated layer water injection is the important technology to realize the oilfield long-term high and stable yield. Through continuous researches and te...
Substrate Warpage Study for Heterogeneous Packages
Substrate Warpage Study for Heterogeneous Packages
Warpage formation in semiconductor packages is generally known to occur from coefficient of thermal expansion (CTE) mismatches between multilayered materials with different propert...
Control of Water Injection into a Layered Formation
Control of Water Injection into a Layered Formation
Abstract
In previously published work, we have analyzed transient injection of water from a growing vertical hydrofracture into a low-permeability compressible rock ...
Strength of Water Drive or Fluid Injection From Transient Well Test Data
Strength of Water Drive or Fluid Injection From Transient Well Test Data
This paper presents a method for determining the strength of water drive or fluid injection from transient well test data. Graphs are presented for interpreting drawdown and buildu...
Application of Novel Techniques to Fractured Injection Diagnostics in Waterflood Developments
Application of Novel Techniques to Fractured Injection Diagnostics in Waterflood Developments
Abstract
Controlled injection at high rates predominantly under fracture regime has been identified at the onset of most waterflood field developments as being cruci...
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
Wafer-level packaging (WLP) is a pivotal semiconductor packaging technology that enables heterogeneously integrated advanced semiconductor packages with high-density electrical int...
Hyper BGA Package Assembly: Experimental Design and Process Development
Hyper BGA Package Assembly: Experimental Design and Process Development
ABSTRACT
The increasing complexity of Ball Grid Array (BGA) packages, characterized by larger sizes and finer pitches, necessitates the development of advanced as...

