Preparation and properties of phosphorus and nitrogen composite flame retardant electronic packaging epoxy resin material

Epoxy resin (EP) is widely used in electronics due to its excellent properties and cost efficiency. In this study, to enhance both the mechanical performance and fire safety of EP for engineering applications, a novel phosphorus–nitrogen composite flame-retardant epoxy resin was developed for electronic packaging. The material was synthesized by incorporating the synthesized compounds HPM-EGDGE (A) and DOPO-EGDGE (B) into DGEBA bisphenol A-type epoxy resin. The results demonstrated that the addition of A and B significantly improved the thermal stability and flame retardancy of the composite resin. When 10 wt% of A and B (relative to DGEBA) was added, the resin achieved a UL-94 V-0 rating and a limiting oxygen index (LOI) of 33.1%. Furthermore, the tensile strain and bending strain of EP-3 and EP-4 increased by 42% and 102%, respectively, along with corresponding improvements in tensile and bending strength. Scanning electron microscopy analysis revealed notable differences in the char residue morphology of the composite resins compared to EP-0 after combustion. The presence of A and B promotes char formation and reduces the evolution of flammable gases, thereby enhancing flame retardancy. These results suggest that this material holds great promise for use in advanced engineering applications.