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Milling Microchannels in Monel 400 Alloy by Wire EDM: An Experimental Analysis

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This paper presents the results of an investigation on the capacity of wire electrical discharge machining (WEDM) to produce microchannels in the Nickel-based alloy, Monel 400. The main objective of the current study is to produce microchannels with desired/target geometry and acceptable surface quality. Square cross-sectional microchannels with dimensions of 500 × 500 µm were investigated. Experiments were conducted based on the one-factor-at-a-time approach for the key input WEDM process parameters, namely pulse-on time (TON), pulse-off time (TOFF), average gap voltage (VGAP), wire feed (WF), and dielectric flow rate (FR). Dimensional accuracy, machining speed, surface roughness, surface morphology, microhardness, and microstructure were analyzed to evaluate the microchannels. The minimum errors of 6% and 3% were observed in the width and depth of the microchannels, respectively. Furthermore, microchannels with enhanced surface integrity could be produced exhibiting smooth surface morphology and shallow recast layer (~0–2.55 µm).
Title: Milling Microchannels in Monel 400 Alloy by Wire EDM: An Experimental Analysis
Description:
This paper presents the results of an investigation on the capacity of wire electrical discharge machining (WEDM) to produce microchannels in the Nickel-based alloy, Monel 400.
The main objective of the current study is to produce microchannels with desired/target geometry and acceptable surface quality.
Square cross-sectional microchannels with dimensions of 500 × 500 µm were investigated.
Experiments were conducted based on the one-factor-at-a-time approach for the key input WEDM process parameters, namely pulse-on time (TON), pulse-off time (TOFF), average gap voltage (VGAP), wire feed (WF), and dielectric flow rate (FR).
Dimensional accuracy, machining speed, surface roughness, surface morphology, microhardness, and microstructure were analyzed to evaluate the microchannels.
The minimum errors of 6% and 3% were observed in the width and depth of the microchannels, respectively.
Furthermore, microchannels with enhanced surface integrity could be produced exhibiting smooth surface morphology and shallow recast layer (~0–2.
55 µm).

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