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Interconnections in application specific VLSI
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AbstractProcess technologies developed for the fabrication of Application Specific Integrated Circuits must satisfy some unusual demands imposed by design automation and by fast turn around manufacturing.In this paper we will discuss some of the problems that constrain the selection of a suitable interconnection technology for ASIC's VLSI.Design automation (a tool necessary for ASIC designs) demands a simple set of design rules and very large current carrying capability metal Lines. On the other hand fast turnaround manufacturing requires the use of simple and proven technologies so that the product will be easily manufacturable, possibly in more than one foundry.Some of the available technologies to implement mutilevel interconnections will be reviewed and the one chosen by VLSI Technology for their 1 μm ASIC process will be briefly described.
Title: Interconnections in application specific VLSI
Description:
AbstractProcess technologies developed for the fabrication of Application Specific Integrated Circuits must satisfy some unusual demands imposed by design automation and by fast turn around manufacturing.
In this paper we will discuss some of the problems that constrain the selection of a suitable interconnection technology for ASIC's VLSI.
Design automation (a tool necessary for ASIC designs) demands a simple set of design rules and very large current carrying capability metal Lines.
On the other hand fast turnaround manufacturing requires the use of simple and proven technologies so that the product will be easily manufacturable, possibly in more than one foundry.
Some of the available technologies to implement mutilevel interconnections will be reviewed and the one chosen by VLSI Technology for their 1 μm ASIC process will be briefly described.
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