Why Wedge Bond?

Wedge bonding has the potential to emerge as a driving technology for bonding fine-pitch devices. The deformation (width) of a full strength wedge bond is typically 33% smaller than the smallest diameter ball bond of the same wire diameter. As we move to finer pad pitches which necessitates smaller bond pads (as predicted by the ITRS Roadmap) the diameter of smaller diameter bonding wire presents a roadblock. Smaller diameter wire has significantly lower conductivity (current carrying capacity). Wedge bonding allows use of a larger wire diameter than ball bonding for the same pad size providing higher current for the package. New looping capabilities, higher bonding speed (productivity) and quality assurance tools (Process Integrated Quality Control™) provide high-reliability interconnection solutions for advanced military, aerospace, medical and optoelectronic packages.