Practical Technology of Toughening Epoxy Resin (II): Modification Effects of Special Engineering Plastics on Epoxy Resin

The effects of Special engineering plastics (SEP) such as polyether ether ketone (PEEK), polyimide (PI), thermoplastic polyimide (TPI), polyphenylene sulfide (PPS), polysulfone (PSF), liquid crystal polymer (LCP), polyaromatic (PAR) on the mechanical, thermal and electrical properties of epoxy resins were studied in this paper. The engineering plastics with rigid and active elements produce differential phase in the epoxy curing process, which can absorb energy under stress, prevent micro-crack diffusion, and improve the mechanical properties of epoxy resin, including tensile, compression and impact strength. SEP with better heat resistance than epoxy resins are beneficial for improving the heat resistance of epoxy resins. During the epoxy curing process, strong intermolecular forces are generated between SEP and epoxy resin, which further enhances the heat resistance of modified epoxy resins. Better insulation of epoxy resin are achieved by adding engineering plastics with fine insulation equipment. PSF with poor dispersion aggregates to form a weak interface layer, which first fails under stress, and its main mechanical properties slightly decrease. The dispersion of pulp like LCP in epoxy resin is poor, and there is no significant improvement in the mechanical properties of epoxy resin. PAR are difficult to form a homogeneous phase in epoxy resin and cannot be used for epoxy resin modification research.