Nanofluids for Thermal Performance Improvement in Cooling of Electronic Device

Nanofluid is a promising coolant for high-heat dissipation electronics device or system. The effect of nanofluids as thermal performances on a rectangular shape microchannel heat sink (MCHS) is analytically studied. Al2O3, SiC, and CuO nanoparticles dispersing in water were considered for analysis. A steady, laminar, and incompressible flow with constant heat flux was assumed in the channel. Nanofluids with concentrations of 0.5 to 4.0 vol. % were analyzed at two different inlet velocities of 0.5 m/s and 3.0 m/s. The results showed that highest thermal conductivity enhancement was 12.45% by using SiC-water nanofluids. In the case of Al2O3-water and CuO-water nanofluids maximum improvement were 11.98% and 11.36%, respectively for 4.0 vol. % of nanoparticle concentration. Furthermore, nanofluids as a coolant instead of water showed a highest improve of heat flux 8.51% for water-CuO, and 6.44% and 5.60% increase for Al2O3-water and SiC-water, respectively. The maximum pumping power found 0.33 W at 3 m/s and 0.0091 W at 0.5 m/s for the same concentration of 4.0 vol. % for all of these nanofluids.