Using wire electrical discharge machining to investigate process indicators of Polysilicon removal mechanism

Abstract This paper examines the effect of processing parameters of wire electrical discharge machining (WEDM) on the processing indicators of polysilicon. The WEDM, based on COMSOL Multiphysics software, established a thermal-fluid-solid coupling model of polysilicon single pulse discharge. The simulation results show that thermal stress spalling is polysilicon’s primary material removal mechanism during EDM. And through the EDM experiment to verify the accuracy of the simulation model. Based on single-factor experiments, this paper examined the influences of processing parameters on polysilicon processing indicators. The experimental results indicated that open voltage, pulse width, feed velocity, surface roughness (Sa), and material removal rate (MRR) showed a generally increasing trend. In contrast, the influence of pulse interval ratio and feed velocity on the Sa and MRR evinced a nonlinear relationship. These findings could be references for future research on wire EDM’s process optimization and machining.