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Study of Acoustic Emission from the Gate of Gallium Nitride High Electron Mobility Transistors
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Nitrides are the leading semiconductor material used for the fabrication of high electron mobility transistors (HEMTs). They exhibit piezoelectric properties, which, coupled with their high mechanical stiffness, expand their versatile applications into the fabrication of piezoelectric devices. Today, due to advances in device technology that result in a reduction in the size of individual transistor elements and due to increased structural complexity (e.g., multi-gate transistors), the integration of piezoelectric materials into HEMTs leads to an interesting occurrence, namely acoustic emission from the transistor gate due to piezoelectric effects. This could affect the device’s performance, reliability, and durability. However, this phenomenon has not yet been comprehensively described. This paper aims to examine this overlooked aspect of AlGaN/GaN HEMT operation, that is, the acoustic emission from the gate region of the device induced by piezoelectric effects. For this purpose, dedicated test structures were designed, consisting of two narrow 1.7 μm-wide metallization strips placed at distances ranging from 5 μm to 200 μm fabricated in AlGaN/GaN heterostructures to simulate and examine the gate behavior of the HEMT transistor. For comparison, the test device structures were also fabricated on sapphire, which is not a piezoelectric material. Measurements of acoustic and electrical interactions in the microwave range were carried out using the “on wafer” method with Picoprobe’s signal–ground–signal (SGS)-type microwave probes. The dependence of reflectance |S11| and transmittance |S21| vs. frequency was investigated, and the coupling capacitance was determined. An equivalent circuit model of the test structure was developed, and finite element method simulation was performed to study the distribution of the acoustic wave in the nitride layers and substrate for different frequencies using Comsol Multiphysics software. At frequencies up to 2–3 GHz, the formation of volume waves and a surface wave, capable of propagating over long distances (in the order of tens of micrometers) was observed. At higher frequencies, the resulting distribution of displacements as a result of numerous reflections and interferences was more complicated. However, there was always the possibility of a surface wave occurrence, even at large distances from the excitation source. At small gate distances, electrical interactions dominate. Above 100 µm, electrical interactions are comparable to acoustic ones. With further increases in distance, weakly attenuated surface waves will dominate.
Title: Study of Acoustic Emission from the Gate of Gallium Nitride High Electron Mobility Transistors
Description:
Nitrides are the leading semiconductor material used for the fabrication of high electron mobility transistors (HEMTs).
They exhibit piezoelectric properties, which, coupled with their high mechanical stiffness, expand their versatile applications into the fabrication of piezoelectric devices.
Today, due to advances in device technology that result in a reduction in the size of individual transistor elements and due to increased structural complexity (e.
g.
, multi-gate transistors), the integration of piezoelectric materials into HEMTs leads to an interesting occurrence, namely acoustic emission from the transistor gate due to piezoelectric effects.
This could affect the device’s performance, reliability, and durability.
However, this phenomenon has not yet been comprehensively described.
This paper aims to examine this overlooked aspect of AlGaN/GaN HEMT operation, that is, the acoustic emission from the gate region of the device induced by piezoelectric effects.
For this purpose, dedicated test structures were designed, consisting of two narrow 1.
7 μm-wide metallization strips placed at distances ranging from 5 μm to 200 μm fabricated in AlGaN/GaN heterostructures to simulate and examine the gate behavior of the HEMT transistor.
For comparison, the test device structures were also fabricated on sapphire, which is not a piezoelectric material.
Measurements of acoustic and electrical interactions in the microwave range were carried out using the “on wafer” method with Picoprobe’s signal–ground–signal (SGS)-type microwave probes.
The dependence of reflectance |S11| and transmittance |S21| vs.
frequency was investigated, and the coupling capacitance was determined.
An equivalent circuit model of the test structure was developed, and finite element method simulation was performed to study the distribution of the acoustic wave in the nitride layers and substrate for different frequencies using Comsol Multiphysics software.
At frequencies up to 2–3 GHz, the formation of volume waves and a surface wave, capable of propagating over long distances (in the order of tens of micrometers) was observed.
At higher frequencies, the resulting distribution of displacements as a result of numerous reflections and interferences was more complicated.
However, there was always the possibility of a surface wave occurrence, even at large distances from the excitation source.
At small gate distances, electrical interactions dominate.
Above 100 µm, electrical interactions are comparable to acoustic ones.
With further increases in distance, weakly attenuated surface waves will dominate.
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