(Invited) Advancing Compound Semiconductors through Heterogeneous Integration

Heterogeneous integration (HI) has been developed for Si-based industrial and R&D applications to minimize form factors while enabling such components as logic chiplets and memory into a single architecture. Sandia National Laboratories has a wide range of on-going research activities in developing HI of various semiconductor materials and devices such as optoelectronics and microelectromechanical systems, utilizing a variety of HI technologies, including fine pitch indium thermocompression bonding, solder reflow attachment, and Cu direct bond interconnects (DBI). This talk will provide an overview of present-day capabilities, technologies currently being worked on needed to enable future HI of compound semiconductors, as well as an overview of the progress to-date of Sandia’s research. Acknowledgment: This work was supported in part by the Laboratory Directed Research and Development program at Sandia National Laboratories. Sandia National Laboratories is a multi-mission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International, Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA-0003525. This paper describes objective technical results and analysis. Any subjective views or opinions that might be expressed in the paper do not necessarily represent the views of the U.S. Department of Energy or the United States Government.