Javascript must be enabled to continue!
Coulomb Interaction Effect Correction in Electron-Beam Block Exposure Lithography
View through CrossRef
A new proximity effect correction technique for variably shaped
beam and block exposure tools capable of correcting pattern size
variations due to the Coulomb interaction effect is proposed. The
Coulomb interaction affects the forward scattering term of a
double-Gaussian energy intensity distribution. The double-Gaussian
energy intensity distribution function is modified so that the forward
scattering term has an electron-beam current dependency. The
relationship between the electron-beam current and electron-beam blur
is determined by a knife-edge electron-beam profile
measurement. Experiments show that the relationship between the
electron-beam blur and the current can be roughly approximated by a
linear function of the electron-beam current below 1.5 µA. This
relationship is applied to the double-Gaussian-based proximity effect
correction program. Successful correction is demonstrated for 0.13 µm L/S test patterns.
Title: Coulomb Interaction Effect Correction in Electron-Beam Block Exposure Lithography
Description:
A new proximity effect correction technique for variably shaped
beam and block exposure tools capable of correcting pattern size
variations due to the Coulomb interaction effect is proposed.
The
Coulomb interaction affects the forward scattering term of a
double-Gaussian energy intensity distribution.
The double-Gaussian
energy intensity distribution function is modified so that the forward
scattering term has an electron-beam current dependency.
The
relationship between the electron-beam current and electron-beam blur
is determined by a knife-edge electron-beam profile
measurement.
Experiments show that the relationship between the
electron-beam blur and the current can be roughly approximated by a
linear function of the electron-beam current below 1.
5 µA.
This
relationship is applied to the double-Gaussian-based proximity effect
correction program.
Successful correction is demonstrated for 0.
13 µm L/S test patterns.
Related Results
Evaluation of the Coulomb logarithm using cutoff and screened Coulomb interaction potentials
Evaluation of the Coulomb logarithm using cutoff and screened Coulomb interaction potentials
The Coulomb logarithm is a fundamental plasma parameter which is commonly derived within the framework of the binary collision approximation. The conventional formula for the Coulo...
Investigation on focus and transport characteristics of high transmission rate sheet electron beam
Investigation on focus and transport characteristics of high transmission rate sheet electron beam
The investigation on focus and transport characteristics of sheet electron beam has been a key technique for the development of high-power microwave and millimeter-wave vacuum elec...
Analysis of Coulomb Stress of Sumatera Earthquake Against Pyroclastic Flow of Mount Sinabung as Data Prone Volcano Disaster
Analysis of Coulomb Stress of Sumatera Earthquake Against Pyroclastic Flow of Mount Sinabung as Data Prone Volcano Disaster
The islands of Sumatra and Sinabung are located southwest of the Sundaland Continent which is a convergence route between the Indian-Australian Plate that infiltrates to the west o...
Intra-Level Mix-and-Match Lithography Process for Fabricating Sub-100-nm Complementary Metal-Oxide-Semiconductor Devices using the JBX-9300FS Point-Electron-Beam System
Intra-Level Mix-and-Match Lithography Process for Fabricating Sub-100-nm Complementary Metal-Oxide-Semiconductor Devices using the JBX-9300FS Point-Electron-Beam System
To increase the throughput of electron beam lithography used to fabricate sub-100-nm patterns, we developed an electron beam and deep UV intra-level mix-and-match lithography proce...
Isolation, characterization and semi-synthesis of natural products dimeric amide alkaloids
Isolation, characterization and semi-synthesis of natural products dimeric amide alkaloids
Isolation, characterization of natural products dimeric amide alkaloids from roots of the Piper chaba Hunter. The synthesis of these products using intermolecular [4+2] cycloaddit...
Probability distribution-based method for aberration budgeting in EUV lithography
Probability distribution-based method for aberration budgeting in EUV lithography
Extreme ultraviolet (EUV) lithography is one of the most indispensable technologies in semiconductor manufacturing for 7 nm and smaller technology nodes. However, many key paramete...
H atom parameters: how Classical Physics gives new/clear results
H atom parameters: how Classical Physics gives new/clear results
In our recent paper [A. Bacchieri, Phys. Essays 36, 61 (2023)], we had found that the total escape speed from all the masses in the universe, u = (‐2 u)1/2, where u is the total gr...
Resist Requirements and Limitations for Nanoscale Electron-Beam Patterning
Resist Requirements and Limitations for Nanoscale Electron-Beam Patterning
ABSTRACTElectron beam lithography still represents the most effective way to pattern materials at the nanoscale, especially in the case of structures, which are not indefinitely re...

