ELECTRODEPOSITION OF COPPER ONTO POLYPYRROLE FILMS: APPLICATION TO PROTON REDUCTION

In this paper, we have electrodeposited copper on polypyrrole surface. Results show that at high applied cathodic potential ([Formula: see text][Formula: see text][Formula: see text]1.8[Formula: see text]V), copper electrodeposition occurs with difficulties. The amount of electrodeposited copper is low (1.32%) and it is limited by the low polypyrrole conductivity. At this potential, poor conductivity is caused by its insulating state. However, at an applied cathodic potential of [Formula: see text]1.2[Formula: see text]V, the polypyrrole exhibits a relatively high conductivity and copper particles are electrodeposited with large amounts (12.44%) on polypyrrole/silicon system. At high applied cathodic potential, the SEM images show clearly dispersed grains of copper, but polypyrrole surface is less occupied. At an applied cathodic potential of [Formula: see text]1.2[Formula: see text]V, the SEM image shows that polypyrrole surface is homogenously more occupied with copper. After copper deposition, the Cu/PPy/Si system is used to catalyze the hydrogen reaction. It was found that, once the deposited copper is present with considerable amounts, the proton reduction occurs easily. As for the polypyrrole conductivity, it was found that electrodeposited copper onto PPy/Si surface affect the total conductivity.