Search engine for discovering works of Art, research articles, and books related to Art and Culture
ShareThis
Javascript must be enabled to continue!

Progress in joining of advanced materials: Part 1: Solid state joining, fusion joining, and joining of intermetallics

View through CrossRef
Advanced materials generally require novel joining techniques. Developments in new materials research should be conducted hand in hand with work on weldability and joining capacity aspects. Sound joint quality for any new material has always been considered a milestone in a research and development scheme for a new material, particularly in terms of widespread applications. Better understanding of the microstructure–mechanical properties relationships of the bonded or welded joints will feed back to the materials development activities both in conventional and new materials areas. The two joining processes diffusion bonding and laser welding are considered in this literature review, since these processes are capable of joining a wide range of materials of interest in the aerospace industry, as well as in many other industrial applications, and offer remarkable advantages over conventional fusion welding processes. Of particular interest is the ability to join the more difficult aerospace alloys with minimal component distortion and high reproducibility of joint quality. The purpose of the review is to outline progress made in this area and to make suggestions for future work. Part 1 deals with solid state joining, fusion joining, and joining of intermetallics, while Part 2 will cover joining of metal matrix composites and joining of other advanced materials.
Title: Progress in joining of advanced materials: Part 1: Solid state joining, fusion joining, and joining of intermetallics
Description:
Advanced materials generally require novel joining techniques.
Developments in new materials research should be conducted hand in hand with work on weldability and joining capacity aspects.
Sound joint quality for any new material has always been considered a milestone in a research and development scheme for a new material, particularly in terms of widespread applications.
Better understanding of the microstructure–mechanical properties relationships of the bonded or welded joints will feed back to the materials development activities both in conventional and new materials areas.
The two joining processes diffusion bonding and laser welding are considered in this literature review, since these processes are capable of joining a wide range of materials of interest in the aerospace industry, as well as in many other industrial applications, and offer remarkable advantages over conventional fusion welding processes.
Of particular interest is the ability to join the more difficult aerospace alloys with minimal component distortion and high reproducibility of joint quality.
The purpose of the review is to outline progress made in this area and to make suggestions for future work.
Part 1 deals with solid state joining, fusion joining, and joining of intermetallics, while Part 2 will cover joining of metal matrix composites and joining of other advanced materials.

Related Results

The Nuclear Fusion Award
The Nuclear Fusion Award
The Nuclear Fusion Award ceremony for 2009 and 2010 award winners was held during the 23rd IAEA Fusion Energy Conference in Daejeon. This time, both 2009 and 2010 award winners w...
Self-Diffusion, Solute-Diffusion and Interdiffusion in Binary Intermetallics
Self-Diffusion, Solute-Diffusion and Interdiffusion in Binary Intermetallics
800x600 Intermetallics are compounds of two metals or of metal(s) and semimetal(s). Their structures are usually different from those of the constituents. Some intermetallics are i...
Nonproliferation and fusion power plants
Nonproliferation and fusion power plants
Abstract The world now appears to be on the brink of realizing commercial fusion. As fusion energy progresses towards near-term commercial deployment, the question arises a...
The effects of aged Cu‐Al intermetallics to electrical resistance in microelectronics packaging
The effects of aged Cu‐Al intermetallics to electrical resistance in microelectronics packaging
A Cu‐Al bonding system exists when copper wire is bonded onto an aluminum bond pad using thermosonic wire bonding technology. Aged Cu‐Al bonding system was analyzed by measuring th...
The Diverse Landscape of Fusion Transcripts in 25 Different Hematological Entities
The Diverse Landscape of Fusion Transcripts in 25 Different Hematological Entities
Background: Genomic alterations are a hallmark of hematological malignancies and comprise small nucleotide variants, copy number alterations and structural variants (SV). SV lead t...
Fusion rate: a time-to-event phenomenon
Fusion rate: a time-to-event phenomenon
Object.The term “fusion rate” is generally denoted in the literature as the percentage of patients with successful fusion over a specific range of follow up. Because the time to fu...

Back to Top