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Fabrication of Au Fine Patterns by Ar Sputter Etching Using MoO3 Mask
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A new fabrication technique of fine Au patterns using a bilevel MoO3 film is proposed. In this process, the MoO3 film is used as an electron resist for patterning, followed by Au layer etching with Ar-ion sputtering, using the bilevel MoO3 layer as a mask. The upper layer of the bilevel MoO3 resist is suitable for use as a mask layer. The lower layer, which is sputter-deposited with lower rf power, is useful for easy removal of the MoO3 mask after sputter etching of the Au layer.
Title: Fabrication of Au Fine Patterns by Ar Sputter Etching Using MoO3 Mask
Description:
A new fabrication technique of fine Au patterns using a bilevel MoO3 film is proposed.
In this process, the MoO3 film is used as an electron resist for patterning, followed by Au layer etching with Ar-ion sputtering, using the bilevel MoO3 layer as a mask.
The upper layer of the bilevel MoO3 resist is suitable for use as a mask layer.
The lower layer, which is sputter-deposited with lower rf power, is useful for easy removal of the MoO3 mask after sputter etching of the Au layer.
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