Javascript must be enabled to continue!
Functionally Undetectable Interconnect Faults in Chiplet-Based Designs
View through CrossRef
Chiplet-based designs use large numbers of interconnects that need to be tested thoroughly. Standard isolation logic allows the logic blocks (chiplets) and the interconnects to be tested separately. It was recently suggested for additional defect coverage to use a scan-based test set that tests the interconnects together with the logic blocks in a mode of operation that is closer to functional. In this scenario, a scan-based test set for a logic block targets faults in the logic block as well as the interconnects it drives. An exhaustive static fault model was used earlier for subsets of adjacent interconnects. In the same scenario, this article studies the presence of functionally undetectable interconnect faults, and their relationship to the configuration of the interconnects as a two-dimensional array. The article observes that the specific configuration of the interconnects in the two-dimensional array can affect the number of functionally undetectable faults. Moreover, by modifying the configuration, it is possible to eliminate functionally undetectable faults that are important to consider in other configurations. The article describes a test generation procedure that includes the identification of functionally undetectable interconnect faults, and a procedure for reconfiguring the interconnects to eliminate undetectable faults. The implementation of the procedures was carried out in an academic simulation environment. Experimental results for benchmark circuits demonstrate the effectiveness of the procedures in achieving complete interconnect fault coverage, and eliminating all the undetectable interconnect faults.
Association for Computing Machinery (ACM)
Title: Functionally Undetectable Interconnect Faults in Chiplet-Based Designs
Description:
Chiplet-based designs use large numbers of interconnects that need to be tested thoroughly.
Standard isolation logic allows the logic blocks (chiplets) and the interconnects to be tested separately.
It was recently suggested for additional defect coverage to use a scan-based test set that tests the interconnects together with the logic blocks in a mode of operation that is closer to functional.
In this scenario, a scan-based test set for a logic block targets faults in the logic block as well as the interconnects it drives.
An exhaustive static fault model was used earlier for subsets of adjacent interconnects.
In the same scenario, this article studies the presence of functionally undetectable interconnect faults, and their relationship to the configuration of the interconnects as a two-dimensional array.
The article observes that the specific configuration of the interconnects in the two-dimensional array can affect the number of functionally undetectable faults.
Moreover, by modifying the configuration, it is possible to eliminate functionally undetectable faults that are important to consider in other configurations.
The article describes a test generation procedure that includes the identification of functionally undetectable interconnect faults, and a procedure for reconfiguring the interconnects to eliminate undetectable faults.
The implementation of the procedures was carried out in an academic simulation environment.
Experimental results for benchmark circuits demonstrate the effectiveness of the procedures in achieving complete interconnect fault coverage, and eliminating all the undetectable interconnect faults.
Related Results
Subtle Faults Characterization Based on Fault Simulation and AI OBN Seismic Attributes Optimization
Subtle Faults Characterization Based on Fault Simulation and AI OBN Seismic Attributes Optimization
Abstract
Subtle faults are often below seismic resolution, especially in strike slip regimes, it is very difficult to identify them as they have small throw and the ...
Know Time to Die – Integrity Checking for Zero Trust Chiplet-based Systems Using Between-Die Delay PUFs
Know Time to Die – Integrity Checking for Zero Trust Chiplet-based Systems Using Between-Die Delay PUFs
Industry trends are moving toward increasing use of chiplets as a replacement for monolithic fabrication in many modern chips. Each chiplet is a separately-produced silicon die, an...
Characteristics of Salt-Related Faults in Abu Dhabi, UAE
Characteristics of Salt-Related Faults in Abu Dhabi, UAE
Abstract
Kinematically salt-related faults and fault linkage in Abu Dhabi were classified based on the faults geometry, linkage patterns, deformed layers, and associ...
FDI algorithms of abrupt faults in controlled autoregressive processes
FDI algorithms of abrupt faults in controlled autoregressive processes
PurposeThe purpose of this paper is to present research in detecting and identifying abrupt faults in controlled auto‐regressive (CAR) processes.Design/methodology/approachModel‐ba...
AI-Assisted Subtle Faults Characterization Based on the Integrated Seismic Diffraction Imaging and its Application in M Oilfield, Middle East
AI-Assisted Subtle Faults Characterization Based on the Integrated Seismic Diffraction Imaging and its Application in M Oilfield, Middle East
Abstract
Subtle faults play a key role in reservoir characterization. Due to subtle faults in carbonate reservoirs are often below seismic resolution, it is very dif...
Prognostic Value of ctDNA Mutation in Melanoma: A Meta-Analysis
Prognostic Value of ctDNA Mutation in Melanoma: A Meta-Analysis
Purpose. Melanoma is the most aggressive form of skin cancer. Circulating tumor DNA (ctDNA) is a diagnostic and prognostic marker of melanoma. However, whether ctDNA mutations can ...
Chiplet Technology: Revolutionizing Semiconductor Design- A Review
Chiplet Technology: Revolutionizing Semiconductor Design- A Review
This article explores the transformative journey of semiconductor design from monolithic structures to the cutting-edge era of chiplets. Chiplets, modular components offering speci...
Fault System Evolution and Its Influences on Buried-hills Formation in Tanhai Area of Jiyang Depression, Bohai Bay Basin, China
Fault System Evolution and Its Influences on Buried-hills Formation in Tanhai Area of Jiyang Depression, Bohai Bay Basin, China
<p>Buried-hills, paleotopographic highs covered by younger sediments, become the focused area of exploration in China in pace with the reduction of hydrocarbon resour...

