Dynamic Mechanical Analysis of Nanosilica Filled Epoxy Nanocomposites

In this study, Dynamic Mechanical Analyzer (DMA) was used to study the effect of nanoparticles, which is nanosilica, on glass transition temperature (Tg) of epoxy polymer. A series of epoxy based nanosilica composite with 5-25 wt% nanosilica content was prepared using mechanical stirring method. The weight fractions of nanosilica in epoxy were 5 wt%, 13 wt% and 25 wt%. 30mm x 10mm x 3mm size specimens were tested using DMA machine from room temperature up to 180oC at 2°C/min heating rate. From the analysis of the results, dynamic modulus and glass transition temperature of pure polymer and nanosilica filled polymer were obtained. The glass transition of a polymer composite is a temperature-induced change in the matrix material from the glassy to the rubbery state during heating or cooling. Glass transition temperature Tg was determined using several method: storage modulus onset, loss modulus peak, and tan δ peak. The results showed that the presence of nanosilica reduced Tg of epoxy polymer.