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Post-treatment for Printed Electronics
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The presence of insulating organic components between the functional electronic components in printing inks makes a drastic reduction in the number of percolation paths in the printed patterns. Nevertheless, this also results in the printed tracks having very high resistivity that cannot be put into practical application. In this chapter, the main sintering process methods, including conventional thermal sintering, photonic sintering, laser sintering, plasma sintering, microwave sintering and electrical sintering techniques, are demonstrated.
Title: Post-treatment for Printed Electronics
Description:
The presence of insulating organic components between the functional electronic components in printing inks makes a drastic reduction in the number of percolation paths in the printed patterns.
Nevertheless, this also results in the printed tracks having very high resistivity that cannot be put into practical application.
In this chapter, the main sintering process methods, including conventional thermal sintering, photonic sintering, laser sintering, plasma sintering, microwave sintering and electrical sintering techniques, are demonstrated.
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