Search engine for discovering works of Art, research articles, and books related to Art and Culture
ShareThis
Javascript must be enabled to continue!

Interfacial Degradation of Insulator/YBa2Cu3Oy Heterostructure due to Mutual Diffusion of Constituent Atoms

View through CrossRef
The interfacial degradation of the insulator (SrTiO3, BaTiO3, PbTiO3, and BaO etc.)/YBa2Cu3Oy heterostructures during excimer-laser deposition and subsequent annealing has been investigated. The secondary-ion mass spectroscopy (SIMS) measurement revealed, though very crudely, the mutual diffusion of constituent atoms. More precise data have been obtained quantitatively by measuring the change of the zero-resistance temperatures T c0's (Kosterlitz-Thoules transition) of ultrathin YBa2Cu3Oy before and after deposition of the insulating layers and annealing. The interfacial degradation developed with time t as t ∼0.4, reflecting the thermal diffusion of constituents. The degradation also depended on the partnering insulating layer, i.e., it was minimized by BaTiO3 and PbTiO3 (lower-melting-point insulators).
Title: Interfacial Degradation of Insulator/YBa2Cu3Oy Heterostructure due to Mutual Diffusion of Constituent Atoms
Description:
The interfacial degradation of the insulator (SrTiO3, BaTiO3, PbTiO3, and BaO etc.
)/YBa2Cu3Oy heterostructures during excimer-laser deposition and subsequent annealing has been investigated.
The secondary-ion mass spectroscopy (SIMS) measurement revealed, though very crudely, the mutual diffusion of constituent atoms.
More precise data have been obtained quantitatively by measuring the change of the zero-resistance temperatures T c0's (Kosterlitz-Thoules transition) of ultrathin YBa2Cu3Oy before and after deposition of the insulating layers and annealing.
The interfacial degradation developed with time t as t ∼0.
4, reflecting the thermal diffusion of constituents.
The degradation also depended on the partnering insulating layer, i.
e.
, it was minimized by BaTiO3 and PbTiO3 (lower-melting-point insulators).

Related Results

Interfacial thermal conductance of gallium nitride/graphene/diamond heterostructure based on molecular dynamics simulation
Interfacial thermal conductance of gallium nitride/graphene/diamond heterostructure based on molecular dynamics simulation
<sec>Gallium nitride chips are widely used in high-frequency and high-power devices. However, thermal management is a serious challenge for gallium nitride devices. To improv...
Interfacial Adhesion in Fibre-Polymer Composites
Interfacial Adhesion in Fibre-Polymer Composites
<p>The mechanical performance of a fibre-polymer composite is largely determined by the strength of interfacial adhesion across the fibre-polymer phase boundary. Therefore, a...
First-principles calculations of O-atom diffusion on fluorinated graphene
First-principles calculations of O-atom diffusion on fluorinated graphene
Fluorination of graphene is one of the most effective methods to improve the corrosion protection of graphene coatings. In this work, the diffusion and penetration behaviors of O a...
Surface segregation, structural features, and diffusion of NiCu bimetallic nanoparticles
Surface segregation, structural features, and diffusion of NiCu bimetallic nanoparticles
Bimetallic core-shell nanoparticles such as NiCu are of great interest not only due to their excellent stability, selectivity, and magnetic and catalytic properties, but also becau...
Developing CeO2-CoAl2O4 Semiconductor Ionic Based Heterostructure Composite Electrolyte for Low-Temperature Solid Oxide Fuel Cells (SOFCs)
Developing CeO2-CoAl2O4 Semiconductor Ionic Based Heterostructure Composite Electrolyte for Low-Temperature Solid Oxide Fuel Cells (SOFCs)
Semiconductor ionic electrolytes, especially heterostructure composites, have a significant role in enhancing oxide ion conductivity and peak power density (PPD) because of their i...
The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints
The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints
Purpose The purpose of this paper is to investigate the diffusion behaviors of different atoms at the Cu/Cu3Sn interface and the vacancy formation energy, diffusion energy barrier ...
Diffusion and Ion Conduction in Cation-Conducting Oxide Glasses
Diffusion and Ion Conduction in Cation-Conducting Oxide Glasses
In this Chapter we review knowledge about diffusion and cation conduction in oxide glasses. We first remind the reader in Section 1 of major aspects of the glassy state and recall ...
Comment on: Macroscopic water vapor diffusion is not enhanced in snow
Comment on: Macroscopic water vapor diffusion is not enhanced in snow
Abstract. The central thesis of the authors’ paper is that macroscopic water vapor diffusion is not enhanced in snow compared to diffusion through humid air alone. Further, mass di...

Back to Top