Film Cooling of Compound Angle Upstream Sister Holes

Abstract This study introduces a novel and simple strategy; compound angle upstream sister holes (CAUSH) to increase film cooling performance of the cylindrical hole by combining two techniques: Sister holes; (two small round holes placed upstream the primary hole) and compound angle hole. Whereas the upstream sister holes were injected at several compound angles β = 0°, 45°, 75°, and 90°, while the main hole was injected to the streamwise direction at 35° on a flat plate. FLUENT-ANSYS code was used to perform the simulation by solving the 3D Reynolds Averaged Navier-Stokes Equations. The capability of three types of k-ε turbulence modeling combined with the enhanced wall treatment is investigated to predict the film cooling performance of sister holes. A detailed computational analysis of the cooling performance of the (CAUSH) and the flow field was done at a density ratio equal to two (D.R = 2) and four blowing ratios M = 0.25, 0.5, 1.0 and 1.5 to predict the centerline and laterally averaged film cooling performance. The centerline effectiveness results showed that the highest cooling performance from the examined (CAUSH) was obtained at β = 0°, 45°, and 90° for low and high blowing ratio, the highest laterally averaged film cooling performance was captured at β = 0° and 90° for all tested blowing ratios. Also, the results indicated that the upstream sister hole with 90° compound angle holes has the best overall film cooling effectiveness while the worst performance is attained at β = 75°.