Javascript must be enabled to continue!
Highmobility AlGaN/GaN high electronic mobility transistors on GaN homo-substrates
View through CrossRef
Gallium nitride (GaN) has great potential applications in high-power and high-frequency electrical devices due to its superior physical properties.High dislocation density of GaN grown on a foreign substrate leads to poor crystal quality and device reliability.The homo-epitaxial growth of GaN material has low dislocation density,which is the foundation of high performance of AlGaN/GaN highelectronic mobility transistor.However,it is difficult to prepare flat surface of GaN template or GaN substrate in thermal treatment process under the metal-organic chemical vapor deposition (MOCVD) ambient condition in which hydrogen (H2) is commonly used to clean the substrate surface,i.e.,to remove impurities from the substrate surface,since H2 would greatly enhance GaN decomposition in MOCVD high-temperature condition and etch GaN into roughness surfaceIn this work,an alternation gas model of ammonia/hydrogen (NH3/H2) mixed gas and H2 gas is designed.This technique is used in a thermal treatment process of GaN template and substrate by MOCVD.Then,we in-situ grow AlGaN/GaN HEMTs (high electron mobility transistors) on GaN template and GaN substrate,respectively.A series of alternation gas samples with various H2 treatment times is investigated.Optical microscope and atomic force microscope are used to observe the morphologies of GaN template and AlGaN/GaN HEMTs and two-dimensional electron gas (2DEG) mobility and density of AlGaN/GaN HEMTs are measured by contactless Hall measurement.Optical properties of AlGaN/GaN HEMTs are analyzed by photoluminescence at room temperature.The residual impurities of C and O in the GaN epilayer and the interfacial region between GaN epilayer and GaN substrate are analyzed by secondary ion mass spectrometry.The study results show that H2 enhances GaN decomposition in MOCVD at high temperature,and GaN decomposition greatly strengthens with H2 treatment time increasing leading to rough surface and the decrease of 2DEG mobility.The NH3/2 mixed gas could suppress GaN decomposition and avoid roughn surface,but go against cleaning out the purity from GaN surface,and the relativive intensity of the yellow band is higher.The NH3/2 mixed gas and 2 gas alternate thermal treatment model with proper 2 treatment time on GaN template or GaN substrate,not only obtains atomically flat surface of GaN template and HEMT structure,but also cleans out the purity from GaN surface,which is conducive to the increase of the electric properties of HEMT material.The highest 2DEG mobility reaches to 2136 cm2/V·s with 1 min 2 treatment in the alternate gas thermal treatment process grown on GaN templates and the electrical properties of HEMT material turn excellent.Finally,an alternate model with 5 min NH3/2 mixed gas followed by 1 min 2 and then 4 min mixed gas of thermal treatment process is used,the surface morphology of HEMT grown on GaN substrate shows highly uniform atomically steps and the root-mean-square value is 0.126 nm for 2 μm×2 μm scan area;the HEMT 2DEG mobility 2113 cm2/V·s grown on GaN substrate shows good electric properties,the residual impurities of C and O in the interfacial region between GaN epilayer and GaN substrates are below 1×1017 cm-3,showing clean interfacial.
Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences
Title: Highmobility AlGaN/GaN high electronic mobility transistors on GaN homo-substrates
Description:
Gallium nitride (GaN) has great potential applications in high-power and high-frequency electrical devices due to its superior physical properties.
High dislocation density of GaN grown on a foreign substrate leads to poor crystal quality and device reliability.
The homo-epitaxial growth of GaN material has low dislocation density,which is the foundation of high performance of AlGaN/GaN highelectronic mobility transistor.
However,it is difficult to prepare flat surface of GaN template or GaN substrate in thermal treatment process under the metal-organic chemical vapor deposition (MOCVD) ambient condition in which hydrogen (H2) is commonly used to clean the substrate surface,i.
e.
,to remove impurities from the substrate surface,since H2 would greatly enhance GaN decomposition in MOCVD high-temperature condition and etch GaN into roughness surfaceIn this work,an alternation gas model of ammonia/hydrogen (NH3/H2) mixed gas and H2 gas is designed.
This technique is used in a thermal treatment process of GaN template and substrate by MOCVD.
Then,we in-situ grow AlGaN/GaN HEMTs (high electron mobility transistors) on GaN template and GaN substrate,respectively.
A series of alternation gas samples with various H2 treatment times is investigated.
Optical microscope and atomic force microscope are used to observe the morphologies of GaN template and AlGaN/GaN HEMTs and two-dimensional electron gas (2DEG) mobility and density of AlGaN/GaN HEMTs are measured by contactless Hall measurement.
Optical properties of AlGaN/GaN HEMTs are analyzed by photoluminescence at room temperature.
The residual impurities of C and O in the GaN epilayer and the interfacial region between GaN epilayer and GaN substrate are analyzed by secondary ion mass spectrometry.
The study results show that H2 enhances GaN decomposition in MOCVD at high temperature,and GaN decomposition greatly strengthens with H2 treatment time increasing leading to rough surface and the decrease of 2DEG mobility.
The NH3/2 mixed gas could suppress GaN decomposition and avoid roughn surface,but go against cleaning out the purity from GaN surface,and the relativive intensity of the yellow band is higher.
The NH3/2 mixed gas and 2 gas alternate thermal treatment model with proper 2 treatment time on GaN template or GaN substrate,not only obtains atomically flat surface of GaN template and HEMT structure,but also cleans out the purity from GaN surface,which is conducive to the increase of the electric properties of HEMT material.
The highest 2DEG mobility reaches to 2136 cm2/V·s with 1 min 2 treatment in the alternate gas thermal treatment process grown on GaN templates and the electrical properties of HEMT material turn excellent.
Finally,an alternate model with 5 min NH3/2 mixed gas followed by 1 min 2 and then 4 min mixed gas of thermal treatment process is used,the surface morphology of HEMT grown on GaN substrate shows highly uniform atomically steps and the root-mean-square value is 0.
126 nm for 2 μm×2 μm scan area;the HEMT 2DEG mobility 2113 cm2/V·s grown on GaN substrate shows good electric properties,the residual impurities of C and O in the interfacial region between GaN epilayer and GaN substrates are below 1×1017 cm-3,showing clean interfacial.
Related Results
Studies on the Influences of i-GaN, n-GaN, p-GaN and InGaN Cap Layers in AlGaN/GaN High-Electron-Mobility Transistors
Studies on the Influences of i-GaN, n-GaN, p-GaN and InGaN Cap Layers in AlGaN/GaN High-Electron-Mobility Transistors
Systematic studies were performed on the influence of different cap layers of i-GaN, n-GaN, p-GaN and InGaN on AlGaN/GaN high-electron-mobility transistors (HEMTs) grown on sapphi...
Carrier Localization at Atomic‐Scale Compositional Fluctuations in Single AlGaN Nanowires with Nano‐Cathodoluminescence
Carrier Localization at Atomic‐Scale Compositional Fluctuations in Single AlGaN Nanowires with Nano‐Cathodoluminescence
Considerable interest has been generated to develop highly efficient deep ultraviolet (DUV) emitters using AlGaN‐based alloys with direct bandgaps between 3.4 – 6.1 eV for a broad ...
Advanced AlGaN/GaN HEMT technology, design, fabrication and characterization
Advanced AlGaN/GaN HEMT technology, design, fabrication and characterization
Nowadays, the microelectronics technology is based on the mature and very well established silicon (Si) technology. However, Si exhibits some important limitations regarding its vo...
Effects of interface states and temperature on the C-V behavior of metal/insulator/AlGaN/GaN heterostructure capacitors
Effects of interface states and temperature on the C-V behavior of metal/insulator/AlGaN/GaN heterostructure capacitors
The impact of states at the insulator/AlGaN interface on the capacitance-voltage (C-V) characteristics of a metal/insulator/AlGaN/GaN heterostructure (MISH) capacitor was examined ...
Growth of AlGaN/GaN heterojunction field effect transistors on semi-insulating GaN using an AlGaN interlayer
Growth of AlGaN/GaN heterojunction field effect transistors on semi-insulating GaN using an AlGaN interlayer
Semi-insulating (SI) GaN layers were grown on 4H-SiC substrates by inserting an AlGaN layer between the AlN buffer and the GaN layer. Secondary ion mass spectroscopy measurements s...
Base Transit Time in Abrupt GaN/InGaN/GaN and AlGaN/GaN/AlGaN HBTs
Base Transit Time in Abrupt GaN/InGaN/GaN and AlGaN/GaN/AlGaN HBTs
AbstractBase transit time, τb, in abrupt npn GaN/InGaN/GaN and AlGaN/GaN/AlGaN double heterojunction bipolar transistors (DHBTs) is reported. Base transit time strongly depends not...
Effects of GaN/AlGaN/Sputtered AlN nucleation layers on performance of GaN-based ultraviolet light-emitting diodes
Effects of GaN/AlGaN/Sputtered AlN nucleation layers on performance of GaN-based ultraviolet light-emitting diodes
AbstractWe report on the demonstration of GaN-based ultraviolet light-emitting diodes (UV LEDs) emitting at 375 nm grown on patterned sapphire substrate (PSS) with in-situ low temp...
Growth and characterization of AlGaN/GaN/AlGaN double-heterojunction high-electron-mobility transistors on 100-mm Si(111) using ammonia-molecular beam epitaxy
Growth and characterization of AlGaN/GaN/AlGaN double-heterojunction high-electron-mobility transistors on 100-mm Si(111) using ammonia-molecular beam epitaxy
To improve the confinement of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) heterostructures, AlGaN/GaN/AlGaN double heterojunction HEMT...

