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Application of Sr2Nb2O7 Family Ferroelectric Films for Ferroelectric Memory Field Effect Transistor
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The compounds of the Sr2Nb2O7 (SNO) family are suitable for use
as ferroelectric materials for ferroelectric memory field effect transistors
(FETs),
because these substances have a low dielectric constant,
low coercive field
and high heat-resistance.
In this study, we succeeded in preparing
Sr2(Ta,Nb)2O7 (STN) capacitors
on polycrystalline silicon (poly-Si).
From SIMS profiles,
no interdiffusion
in the STN metal ferroelectric metal insulator semiconductor (MFMIS)
structure was confirmed.
C–V and I
D–V
G hysteresis curves
which were dependent on ferroelectric polarization were obtained.
These capacitors were applied to
floating gate type ferroelectric random access memory (FFRAM) cells.
The degradation in ferroelectricity of STN capacitors
was not observed
during FFRAM cell fabrication process.
We succeeded in operating FFRAM cells with a lower voltage
than that required for PZT
and confirmed
the drain current difference of 1 or 2 orders
at the 30 s after applying write pulses of ±5 V or ±10 V.
Title: Application of Sr2Nb2O7 Family Ferroelectric Films for Ferroelectric Memory Field Effect Transistor
Description:
The compounds of the Sr2Nb2O7 (SNO) family are suitable for use
as ferroelectric materials for ferroelectric memory field effect transistors
(FETs),
because these substances have a low dielectric constant,
low coercive field
and high heat-resistance.
In this study, we succeeded in preparing
Sr2(Ta,Nb)2O7 (STN) capacitors
on polycrystalline silicon (poly-Si).
From SIMS profiles,
no interdiffusion
in the STN metal ferroelectric metal insulator semiconductor (MFMIS)
structure was confirmed.
C–V and I
D–V
G hysteresis curves
which were dependent on ferroelectric polarization were obtained.
These capacitors were applied to
floating gate type ferroelectric random access memory (FFRAM) cells.
The degradation in ferroelectricity of STN capacitors
was not observed
during FFRAM cell fabrication process.
We succeeded in operating FFRAM cells with a lower voltage
than that required for PZT
and confirmed
the drain current difference of 1 or 2 orders
at the 30 s after applying write pulses of ±5 V or ±10 V.
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