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Femtosecond laser machining of transparent, brittle materials: ablative and non-ablative femtosecond laser processing
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This paper focuses on precision machining of transparent materials by means of ablative and non-ablative femtosecond laser processing. Ablation technology will be compared with a newly developed patent pending non-ablative femtosecond process, ClearShape™, using the Spectra-Physics® Spirit® industrial femtosecond laser.
Title: Femtosecond laser machining of transparent, brittle materials: ablative and non-ablative femtosecond laser processing
Description:
This paper focuses on precision machining of transparent materials by means of ablative and non-ablative femtosecond laser processing.
Ablation technology will be compared with a newly developed patent pending non-ablative femtosecond process, ClearShape™, using the Spectra-Physics® Spirit® industrial femtosecond laser.
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