Influence of Drying Temperature in the Oven on Physical, Morphology and Mechanical Properties of Mycelium Composite

Mycelium, a root-like fungi network, possesses distinctive characteristics that render it an appealing contender for replacing polystyrene (PS). Drying in the oven is one of the most commonly used methods for producing mycelium composites. However, achieving its desired properties requires proper control of the drying temperature. This research aims to develop a mycelium-based composite by utilising an edible mushroom, specifically Pleurotus ostreatus (oyster mushroom), as an alternative to non-biodegradable materials for packaging applications. The composite is developed by inoculating Pleurotus ostreatus fungi into the substrate, mainly consisting of kenaf, wheat bran and CaCO3. Afterwards, the composite was incubated for 20 days and then subjected to drying at different oven temperatures (e.g. 40°C, 60°C, and 80°C) for 24 hours. Our findings indicate that the desirable mechanical properties of mycelium composite were found at 60°C, where flexural strength, flexural modulus and impact strength were obtained at 0.11 MPa, 4.15 GPa and 635.8 N, respectively. The moisture content was 26.13%, and the shrinkage was 20.73%. The obtained density of 0.15 g/cm3 was compared to the density of PS, which is 1.04 g/cm3. This research indicates that a lightweight composite material, consisting of a network of interconnected hyphae that function as a natural adhesive, holds significant potential as a viable solution for achieving a more sustainable and environmentally friendly future, primarily due to its biodegradability.