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Synthesis and Characterization of UV-Curable Cross-Linked Carbazole Substituted Poly(Dimethylsiloxane) for Optoelectronic Encapsulant
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This paper report the synthesis of a crosslink network of Carbazole substituted Poly (dimethylsiloxane). Vinyl Carbazole and Vinyl Trimethoxysilane were introduced into polydimethylsiloxane chain backbone through hydrosilylation reaction. 4-hydroxybutyl acrylate was then grafted into vinyl trimethoxysilane by condensation followed by UV curing to afford an elastomeric crosslink network. FTIR and 1H NMR spectroscopy were used to confirm the structure of the product as well as monitoring the progress of the reactions. The visual observation shows the changing appearance of the samples with increasing curing time and distance from UV exposure. The materials displayed refractive index between 1.407 1.452 which is within an acceptable range of application as electronic encapsulant. The crosslink network improved material hardness compared to that without. These properties were examined and thoroughly discussed within the scope of Lorentz-Lorenz model.
Trans Tech Publications, Ltd.
Title: Synthesis and Characterization of UV-Curable Cross-Linked Carbazole Substituted Poly(Dimethylsiloxane) for Optoelectronic Encapsulant
Description:
This paper report the synthesis of a crosslink network of Carbazole substituted Poly (dimethylsiloxane).
Vinyl Carbazole and Vinyl Trimethoxysilane were introduced into polydimethylsiloxane chain backbone through hydrosilylation reaction.
4-hydroxybutyl acrylate was then grafted into vinyl trimethoxysilane by condensation followed by UV curing to afford an elastomeric crosslink network.
FTIR and 1H NMR spectroscopy were used to confirm the structure of the product as well as monitoring the progress of the reactions.
The visual observation shows the changing appearance of the samples with increasing curing time and distance from UV exposure.
The materials displayed refractive index between 1.
407 1.
452 which is within an acceptable range of application as electronic encapsulant.
The crosslink network improved material hardness compared to that without.
These properties were examined and thoroughly discussed within the scope of Lorentz-Lorenz model.
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