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Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology
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Creep property of solder alloys is one of the important factors to effect the reliability of
surface mount technology (SMT) soldered joints. The creep behavior and its rupture life of
Sn2.5Ag0.7CuXRE lead-free soldered joints were separately investigated and predicted under
constant temperature by a single shear lap creep specimen with a 1mm2 cross sectional area and
finite element method (FEM) in this paper. Results show that the creep property of
Sn2.5Ag0.7Cu0.1RE is superior to that of the commercial employed lead-free solder Sn3.8Ag0.7Cu
and the creep rupture life of its soldered joints is 8.4 times more than that of Sn2.5Ag0.7Cu solder.
The creep rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints indirectly predicted by FEM
is better in accord with that of actual testing results, which are important to design the reliability of
lead-free soldered joints for SMT.
Trans Tech Publications, Ltd.
Title: Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology
Description:
Creep property of solder alloys is one of the important factors to effect the reliability of
surface mount technology (SMT) soldered joints.
The creep behavior and its rupture life of
Sn2.
5Ag0.
7CuXRE lead-free soldered joints were separately investigated and predicted under
constant temperature by a single shear lap creep specimen with a 1mm2 cross sectional area and
finite element method (FEM) in this paper.
Results show that the creep property of
Sn2.
5Ag0.
7Cu0.
1RE is superior to that of the commercial employed lead-free solder Sn3.
8Ag0.
7Cu
and the creep rupture life of its soldered joints is 8.
4 times more than that of Sn2.
5Ag0.
7Cu solder.
The creep rupture life of Sn2.
5Ag0.
7CuXRE lead-free soldered joints indirectly predicted by FEM
is better in accord with that of actual testing results, which are important to design the reliability of
lead-free soldered joints for SMT.
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