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MSC-PoL: Hybrid GaN-Si Multistacked Switched Capacitor 48V PwrSiP VRM for Chiplets

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<p>This paper presents a multistack switched-capacitor point-of-load (MSC-PoL) voltage regulation module (VRM) with coupled magnetics for ultrahigh-current chiplet systems. In the MSC-PoL architecture, the stacked switched-capacitor cells split the high input voltage into several intermediate voltage rails, which are loaded with the switched-inductor cells to achieve soft charging and voltage regulation. Automatic capacitor voltage balancing and inductor current sharing are realized during the soft charging process. Many inductors of the switched-inductor cells are coupled into one and operated in interleaving to reduce the inductor current ripple and boost the transient speed. A 48-to-1-V/450-A VRM containing two MSC-PoL modules is built and tested, leveraging high voltage GaN devices for the front-end and high current Silicon devices for the back-end. Two ladder-structured coupled inductor designs are developed and compared, one of which installs a leakage magnetic plate to adjust the leakage inductance for lower current ripple. Featuring 3D stacked packaging, the entire power stage, gate drivers, and bootstrap circuits of one MSC-PoL module are enclosed into a 1/16-brick/0.31-in<sup>3</sup>/6-mm-thick package. The peak and the full-load efficiencies as well as the full-load power density (including both gate loss and size) of the MSC-PoL prototype with and without using the leakage plate are 91.7% and 89.5%, 85.8% and 85.6%, and 621 W/in<sup>3</sup> and 724 W/in<sup>3</sup>, respectively. The 6-mm-thick MSC-PoL converter can be embedded into the chiplet or CPU socket, enabling power-supply-in-package (PwrSiP) for extreme efficiency, density, and control bandwidth.</p>
Title: MSC-PoL: Hybrid GaN-Si Multistacked Switched Capacitor 48V PwrSiP VRM for Chiplets
Description:
<p>This paper presents a multistack switched-capacitor point-of-load (MSC-PoL) voltage regulation module (VRM) with coupled magnetics for ultrahigh-current chiplet systems.
In the MSC-PoL architecture, the stacked switched-capacitor cells split the high input voltage into several intermediate voltage rails, which are loaded with the switched-inductor cells to achieve soft charging and voltage regulation.
Automatic capacitor voltage balancing and inductor current sharing are realized during the soft charging process.
Many inductors of the switched-inductor cells are coupled into one and operated in interleaving to reduce the inductor current ripple and boost the transient speed.
A 48-to-1-V/450-A VRM containing two MSC-PoL modules is built and tested, leveraging high voltage GaN devices for the front-end and high current Silicon devices for the back-end.
Two ladder-structured coupled inductor designs are developed and compared, one of which installs a leakage magnetic plate to adjust the leakage inductance for lower current ripple.
Featuring 3D stacked packaging, the entire power stage, gate drivers, and bootstrap circuits of one MSC-PoL module are enclosed into a 1/16-brick/0.
31-in<sup>3</sup>/6-mm-thick package.
The peak and the full-load efficiencies as well as the full-load power density (including both gate loss and size) of the MSC-PoL prototype with and without using the leakage plate are 91.
7% and 89.
5%, 85.
8% and 85.
6%, and 621 W/in<sup>3</sup> and 724 W/in<sup>3</sup>, respectively.
The 6-mm-thick MSC-PoL converter can be embedded into the chiplet or CPU socket, enabling power-supply-in-package (PwrSiP) for extreme efficiency, density, and control bandwidth.
</p>.

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