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The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste
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This paper reports on the effect of activated carbon (AC) addition on the properties of Sn-Cu-Ni (SN100C) solder paste. The composite solder was prepared by mixing reinforcement particles (0, 0.25, 0.5, 0.75 and 1.0 wt. %) into SN100C solder paste. The melting temperature of composite solder was determined by using differential scanning calorimetry (DSC). Wettability of fabricated solder was studied through contact angles between solder and copper substrate interface. The intermetallic compound formation was studied after reflow soldering process.With increased carbon particles addition, the composite solder was found to have a slightly lower melting temperature compared to monolithic solder while the wettability of composite solder effectively had improved. The activated carbon particles in solder paste composite have significant effects on the formation of intermetallic compounds (IMCs) at the solder/Cu substrate interfaces by suppressing the IMCs thickness.
Title: The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste
Description:
This paper reports on the effect of activated carbon (AC) addition on the properties of Sn-Cu-Ni (SN100C) solder paste.
The composite solder was prepared by mixing reinforcement particles (0, 0.
25, 0.
5, 0.
75 and 1.
0 wt.
%) into SN100C solder paste.
The melting temperature of composite solder was determined by using differential scanning calorimetry (DSC).
Wettability of fabricated solder was studied through contact angles between solder and copper substrate interface.
The intermetallic compound formation was studied after reflow soldering process.
With increased carbon particles addition, the composite solder was found to have a slightly lower melting temperature compared to monolithic solder while the wettability of composite solder effectively had improved.
The activated carbon particles in solder paste composite have significant effects on the formation of intermetallic compounds (IMCs) at the solder/Cu substrate interfaces by suppressing the IMCs thickness.
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