Numerical Analysis of Fluid Flow and Heat Transfer Characteristics of Novel Microchannel Heat Sink

Microchannel heat sinks have gained prominence in the field of thermal management, offering compact and efficient solutions for dissipating heat flux from high performance electronic devices. Escalating heat flux in modern electronic devices, such as those found in telecommunication equipment, industrial automation equipment, solar devices, and data centre servers has driven the continuous development of microchannel heat sink to achieve efficient thermal management. The critical challenge in thermal management for these devices is to develop a microchannel that enhances heat transfer performance and minimises pressure drop. Heat transfer and pressure drop are two competing factors that determine the practicability of the design for real world application. Improvement in heat transfer performance usually results in an increase in pressure drop and pumping power. This study addresses the challenges of designing microchannel through comprehensive numerical analysis of fluid flow and heat transfer characteristics of a novel design that combines ribs, secondary channels, and tertiary channels. The numerical results showed that the novel microchannel design achieves a favourable balance between heat transfer and pressure drop, demonstrating its potential to be used in application where high heat transfer and efficiency are paramount. To assess the performance of the microchannels, thermal resistance, a measure of system’s resistance to heat transfer is used. At the same pumping power, thermal resistance in the new design is consistently lower compared to other designs.