Research on Junction Temperature Smooth Control of SiC MOSFET Based on Body Diode Conduction Loss Adjustment

In a converter of actual working condition, the change in the current and voltage of the power device will cause the junction temperature to fluctuate greatly. This device is subjected to high thermal stress due to the change in the junction temperature. Therefore, it is necessary to adopt junction temperature control to reduce or smooth the junction temperature fluctuation, so as to realize the junction temperature control and improve the reliability of the device. At present, the methods for the junction temperature control of power devices have certain limitations and there are few active thermal management methods proposed for SiC device characteristics. In this paper, a method for realizing the smooth control of the junction temperature of a SiC device based on the conduction loss adjustment of the body diode for the SiC device has been proposed, considering that the conduction loss of the body diode is greater than the conduction loss of the SiC MOSFET. The conduction time of SiC MOSFET body diode was adjusted. By adjusting the conduction loss of the SiC MOSFET device, the fluctuation range of the junction temperature of the SiC MOSFET device was controlled, the smooth control of the junction temperature of the SiC device was realized, and the thermal stress of the device was reduced.